More info on: FINEPLACER ® femto 2 Automated Sub-micron Die Bonder The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications. The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. Since the DTF process introduction, over 1.000.000 parts have been produced using Argomax® 8020 film. FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform. The Die Transfer Film (DTF) process with Argomax® 8020 film combined with Datacon 2200 evo equipment was introduced for the first time. More info on: ESEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.
DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
#DATACON 2200 EVO PRICE MANUAL#
DATACON 2200 EVO DATACON 2200 EVO MANUAL MANUEL FOR BESI DATACON EVO. Dyno and Drag Strip measure horsepower (manual transmission only) and acceleration. Discover all the information about the product Flip-chip die bonder Datacon 2200 evo - BE Semiconductor Industries and find where you can buy it.